Do notice that the information you posted before says "Solder Pad", not "Mirroring". The solder pad labels on Nintendo's PCBs refer to name table arrangement, which is the opposite of the mirroring nomenclature used by emulators. So what you're seeing here is actually consistent: the solder pad marked "H" results in the name tables being arranged side by side, and mirrored vertically. The solder pad marked "V" would stack the name tables vertically, mirrored horizontally. It's very confusing that whoever created the iNES header went with "mirroting" instead of the convention that was clearly used in the PCBs.koitsu wrote:Cute -- vertical. This could be from an internal database that's forcing the mirroring though... so which mirroring is true?
However, since the MMC1 has dynamically controlled mirroring, the H/V setting in the header does nothing. Unless some emulator is using that information when it shouldn't.
The emulator might be selecting vertical mirroring automatically (by default or from the header setting), which an actual MMC1 isn't guaranteed to do. Only debugging will tell if the mirroring is being properly configured.1. This romhack actually uses vertical mirroring, best I can tell. If triple verification is needed, I can happily go look at the MMC1 writes for mirroring and determine from that. But vertical makes the most sense, IMO.